Hasil Pencarian - Cheng-En Ho

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  1. 1
    Electromigration-induced remarkable intermetallic compound (IMC) formation in micro joints and its prevention

    Electromigration-induced remarkable intermetallic compound (IMC) formation in micro joints and its prevention oleh Pei-Tzu Lee, Cheng-Yu Lee, Wan-Zhen Hsieh, Chih-Tsung Chen, Cheng-En Ho

    Diterbitkan 2023-05-01
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  2. 2
    High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)

    High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF) oleh Pei-Tzu Lee, Chih-Hao Chang, Cheng-Yu Lee, Ying-Syuan Wu, Cheng-Hsien Yang, Cheng-En Ho

    Diterbitkan 2021-08-01
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  3. 3
    Through glass via (TGV) copper metallization and its microstructure modification

    Through glass via (TGV) copper metallization and its microstructure modification oleh Yu-Hsun Chang, Yu-Ming Lin, Cheng-Yu Lee, Pei-Chia Hsu, Chih-Ming Chen, Cheng-En Ho

    Diterbitkan 2024-07-01
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  4. 4
    Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5

    Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5 oleh Pei-Tzu Lee, Wan-Zhen Hsieh, Cheng-Yu Lee, Yu-Hsuan Huang, Ching-Yu Chiang, Ching-Shun Ku, C.R. Kao, Cheng-En Ho

    Diterbitkan 2021-07-01
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