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    Effect of Bonding Temperature on Microstructure Evolution during TLP Bonding of a Ni3Al based Superalloy IC10

    Effect of Bonding Temperature on Microstructure Evolution during TLP Bonding of a Ni3Al based Superalloy IC10 oleh Yue Xiong, Liu Fengmei, Chen Hexing, Wan Di, Qin Hongbo

    Diterbitkan 2018-01-01
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