Hasil Pencarian - Cai-Fu Li

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  1. 1
    Silicon carbide nanowire-reinforced micro-Ag joint based on pinning effect for power electronics packaging

    Silicon carbide nanowire-reinforced micro-Ag joint based on pinning effect for power electronics packaging oleh Mulan Li, Shijun Huang, Zehao Chen, Jingwen Liu, Longlong Yan, Cai-Fu Li

    Diterbitkan 2024-11-01
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  2. 2
    Bottom–Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via

    Bottom–Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via oleh Fu-Long Sun, Zhi-Quan Liu, Cai-Fu Li, Qing-Sheng Zhu, Hao Zhang, Katsuaki Suganuma

    Diterbitkan 2018-02-01
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  3. 3
    Long-time reliable direct bonding of silver flake paste on Al substrate for power electronic die-attachment

    Long-time reliable direct bonding of silver flake paste on Al substrate for power electronic die-attachment oleh Ruidong Luo, Xiaoli Yu, Zhen Wu, Hao Zhang, Zhi-Quan Liu, Katsuaki Suganuma, Cai-Fu Li

    Diterbitkan 2022-03-01
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  4. 4
    Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

    Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere oleh Yue Gao, Wanli Li, Chuantong Chen, Hao Zhang, Jinting Jiu, Cai-Fu Li, Shijo Nagao, Katsuaki Suganuma

    Diterbitkan 2018-12-01
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  5. 5
    Association between oral health-related quality of life and depressive symptoms in Chinese college students: Fitness Improvement Tactics in Youths (FITYou) project

    Association between oral health-related quality of life and depressive symptoms in Chinese college students: Fitness Improvement Tactics in Youths (FITYou) project oleh Zheng Zhang, Ying Tian, Fei Zhong, Cai-fu Li, Shu-mei Dong, Yan Huang, Xing-er Liu, Cong Huang

    Diterbitkan 2019-06-01
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