Hasil Pencarian - C.R. Kao

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  1. 1
    Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressure

    Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressure oleh Y.S. Chiu, C.R. Kao, A. Shigetou

    Diterbitkan 2020-10-01
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  2. 2
    Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation

    Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation oleh Hiroaki Tatsumi, C. R. Kao, Hiroshi Nishikawa

    Diterbitkan 2022-07-01
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  3. 3
    Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations

    Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations oleh Hiroaki Tatsumi, C. R. Kao, Hiroshi Nishikawa

    Diterbitkan 2023-12-01
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  4. 4
    Phase Equilibria Related to NiGa<sub>5</sub> in the Binary Ni-Ga System

    Phase Equilibria Related to NiGa<sub>5</sub> in the Binary Ni-Ga System oleh Chih-Chia Bill Chang, C. R. Kao

    Diterbitkan 2024-02-01
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  5. 5
    Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing

    Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing oleh H.T. Hung, P.T. Lee, C.H. Tsai, C.R. Kao

    Diterbitkan 2020-11-01
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  6. 6
    Effects of bonding pressures on microstructure and mechanical properties of silver–tin alloy powders synthesized by ball milling for high-power electronics packaging

    Effects of bonding pressures on microstructure and mechanical properties of silver–tin alloy powders synthesized by ball milling for high-power electronics packaging oleh Wei Chen Huang, Chin Hao Tsai, Pei Tzu Lee, C.R. Kao

    Diterbitkan 2022-07-01
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  7. 7
    Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling

    Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling oleh Fu-Ling Chang, Yu-Hsin Lin, Han-Tang Hung, Chen-Wei Kao, C. R. Kao

    Diterbitkan 2023-04-01
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  8. 8
    Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate

    Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate oleh Han-Tang Hung, Fu-Ling Chang, Chin-Hao Tsai, Chia-Yi Liao, C. R. Kao

    Diterbitkan 2023-09-01
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  9. 9
    Periodic copper microbead array on silver layer for dual mode detection of glyphosate

    Periodic copper microbead array on silver layer for dual mode detection of glyphosate oleh Ramachandran Balaji, Vengudusamy Renganathan, Chia-Pei Chu, Ying-Chih Liao, C.R. Kao, Shen-Ming Chen

    Diterbitkan 2022-11-01
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  10. 10
    Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps

    Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps oleh Chen-Wei Kao, Po-Yu Kung, Chih-Chia Chang, Wei-Chen Huang, Fu-Ling Chang, C. R. Kao

    Diterbitkan 2022-06-01
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  11. 11
    Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment

    Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment oleh Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, Jiahui Li, Hiroshi Nishikawa, C.R. Kao

    Diterbitkan 2021-11-01
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  12. 12
    Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration

    Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration oleh Po-Yu Kung, Wei-Lun Huang, Chin-Li Kao, Yung-Sheng Lin, Yun-Ching Hung, C. R. Kao

    Diterbitkan 2022-11-01
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  13. 13
    Low-temperature transient liquid phase bonding via electroplated Sn/In–Sn metallization

    Low-temperature transient liquid phase bonding via electroplated Sn/In–Sn metallization oleh Chin-Hao Tsai, Han-Tang Hung, Fu-Ling Chang, Steffen Bickel, Maik Müller, Iuliana Panchenko, Karlheinz Bock, C.R. Kao

    Diterbitkan 2022-07-01
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  14. 14
    Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5

    Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5 oleh Pei-Tzu Lee, Wan-Zhen Hsieh, Cheng-Yu Lee, Yu-Hsuan Huang, Ching-Yu Chiang, Ching-Shun Ku, C.R. Kao, Cheng-En Ho

    Diterbitkan 2021-07-01
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