Hasil Pencarian - A. Dommann

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  1. 1
    A holistic X-ray analytical approach to support sensor design and fabrication: Strain and cracking analysis for wafer bonding processes

    A holistic X-ray analytical approach to support sensor design and fabrication: Strain and cracking analysis for wafer bonding processes oleh A. Borzì, R. Zboray, S. Dolabella, J.F. Le Neal, P. Drljaca, G. Fiorucci, A. Dommann, A. Neels

    Diterbitkan 2021-11-01
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  2. 2
    Electromagnetic levitation containerless processing of metallic materials in microgravity: thermophysical properties

    Electromagnetic levitation containerless processing of metallic materials in microgravity: thermophysical properties oleh M. Mohr, Y. Dong, G. P. Bracker, R. W. Hyers, D. M. Matson, R. Zboray, R. Frison, A. Dommann, A. Neels, X. Xiao, J. Brillo, R. Busch, R. Novakovic, P. Srirangam, H.-J. Fecht

    Diterbitkan 2023-05-01
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